Author’s note: This article was initially published in a compilation of some of the articles published in the Electronics Cooling Magazine ‘Statistics Corner’ [4]. However, it was never published as part of a standard ECM issue. Therefore, it seemed appropriate to reintroduce it to the readers to this series on statistical analysis methods. Abstract Reliability … [Read more...]
Performing a Transient Thermal Characterization of Hardware with a Finite Difference Model
Introduction A transient thermal characterization, also known as a thermal survey, aims to characterize the location of greatest thermal inertia within a hardware system—that is, the location with the slowest temperature response to a given environmental stimulus. This manuscript outlines a methodology for developing a finite difference numerical model of a three-resistor, … [Read more...]
Thermal Design for Externally Worn Wearable Electronics
Introduction Thermal management plays a critical role in the performance, reliability, and longevity of wearable devices. Reliability must be considered even when components remain below their absolute maximum operating temperatures. This is due to increased diffusion rates, material fatigue, and electromigration effects which degrade electronics over time. Additional failure … [Read more...]
Direct Liquid Cooling for High-Compute Servers
In today's technological landscape, the demand for high performance computing continues to soar, driven by advances in artificial intelligence, data analytics, and complex simulations. As processors become more powerful, there has been a rise in the power draw of the servers. To increase the compute capability of the data centers, there is a constant push to increase the rack … [Read more...]
Summary of SEMI-THERM 41 Conference
By Navid Kazem, Lieven Vervecken, and Claire Wemp The SEMI-THERM 41 Symposium was held March 10-13, 2025 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Lieven Vervecken (Diabatix), Program Chair Dr. Navid Kazem (Arieca), and Program Vice Chair Dr. Claire Wemp (DuPont). It featured a variety of activities including technical short … [Read more...]
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