Internet of Things Convention Europe 2016 May 12, 2016 Brussels More information here. … [Read more...]
Room Temperature Metal Bonding – Heralding a Revolution In IC Performance and Reliability?
A reliable electronic product is generally a cool one. In addition, one of the main limiters of non-functional performance is operating temperature. Keep your product cool and it will last longer and/or operate faster. Electronics thermal management has been dogged by thermal resistances at part/part interfaces for decades. Reduce these main bottlenecks in the heat flow path … [Read more...]
Automated Model Calibration in FloTHERM – A Future Cornerstone of Simulation Based Workflows, Today
Available in the recently released FloTHERM V11.1 is the ability to calibrate a FloTHERM simulation model so that it matches experimentally measured results. The calibration process is automatic and results in a model with unrivaled levels of predictive accuracy. The experimental results used are not simple thermocouple based measurements, but T3Ster based measurements that … [Read more...]
Innovative Liquid Cooling Technology for the ExaNeSt Project
Iceotope is using innovative liquid cooling technology for the European project ExaNeSt as reported by Inside HPC. The ExaNeSt project objective is to develop a prototype exascale supercomputer in three years. Peter Hopton from Iceotope explained that in their role in the exascale supercomputing race they “get different devices at very high density that want to be very … [Read more...]
New Solid-State Wine Cellar Cooling Technology
At the recent Consumer Electronics Show, Haier America introduced its “new alternative cooling system for wine cellars,” as reported by DigitalTrends.com. This technology “couples a solid-state chip that is 25 times lighter and 100 times smaller than other cooling compressors with H20/C02 heat exchange technology,” according to DigitalTrends.com. DigitalTrends.com also says … [Read more...]
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