Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Don’t miss out on the March 2012 issue of Electronics Cooling, which includes the 2012 Buyers’ Guide, feature articles on Iconic Winds: A New Frontier for Air Cooling, Thermal Ground Plane Technology Impacts Electronics Packaging, Enhancement of Microchannel Cooling with Oblique Technology, as well as technical briefs.
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Read the March 2012 issue here.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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