New research done by Emerson Network Power recently shows that nearly 50 percent of the United States and Canada have made thermal upgrades to their data center cooling systems. According to the survey of “IT, facilities, and data center managers, […] while 40 percent of data centers have been upgraded in the past five years, nearly 20 percent are in process and about 31 … [Read more...]
New Hybrid Adhesives Use UV Cure and Heat Cure Combination
Epoxy Technology Inc. has released a new line of UV Hybrid adhesives. The company says these adhesives allow “engineers to reach new levels of production/process improvement” and afford “greater design flexibility.” They use “a primary UV cure for tacking, followed by a secondary heat cure for completion,” according to Epoxy, “This unique combination affords engineering … [Read more...]
C-Therm Technologies
Upcoming Thermal Conductivity Webinar January 14, 2016 1:00 PM Online "Thermal Conductivity of Printed Circuit Board Dielectric Materials with Guest Speaker Douglas G. Brooks, President of UltraCAD Design" For more information, click here. … [Read more...]
A Liquid Cooling Method for FPGAs
Georgia Institute of Technology researchers are using microfluidic channels to cool 28nm Altera FPGAs. The university said that by “flowing de-ionized water through” the “microfluidic passages cut directly into the backsides of production FPGAs […] the researchers have demonstrated a monolithically-cooled chip that can operate at temperatures more than 60% below those of … [Read more...]
New Design for Fighter’s Thermal Management Tech
Northrop Aerospace Systems has released a new artistic concept of a sixth-generation fighter that will combine new technology present in the Lockheed Martin F-22 and B-2 with new thermal management technology. According to FlightGlobal.com, Northrop president Tom Vice is putting new focus on the quality of managing the heat generated by future weapons and sensors as it has … [Read more...]
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