Recently I read an article on cutting-edge research demonstrating the feasibility of data storage on media for a million years! A few years ago this might not have resonated with me as a thermal engineer working to cool electronics, but now it does. Let me explain why. Research & Development on IT equipment thermal management over the past few decades has justifiably … [Read more...]
Thermal Facts and Fairy Tales: Evolving the Role of the Thermal Engineer from Analyst to Architect
Scott Johnson, Raytheon Space and Airborne Systems Brendon Holt, Raytheon Missile Systems Evolving trends within the aerospace industry are creating a new set of challenges that directly influence thermal management choices and planning that should be addressed in the early phases of the product development process. Within the functional side of the aerospace industry, … [Read more...]
Boron Nitride Filler for Thermally Conductive Dielectric Plastic Compounds
Saint-Gobain Ceramic Materials has released its new CarboTherm boron nitride thermal management fillers for use in thermally conductive, dielectric plastic compounds. The new boron nitride fillers will be on display December 10-11 at the Compounding World Forum 2013 in Philadelphia, Penn., USA. “Boron nitride, unlike other ceramics, is soft and non-abrading, enabling longer … [Read more...]
Thermal Packaging – From Problem Solver to Performance Multiplier
The increased integration density of electronic components and subsystems, including the nascent commercialization of 3D chip stack technology, has exacerbated the thermal management challenges facing electronic system developers. The sequential conductive and interfacial thermal resistances associated with the prevailing “remote cooling” paradigm in which heat must diffuse … [Read more...]
New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential
Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new Dow Corning Dispensable Thermal Pads offer the potential for broader design latitudes, simplified … [Read more...]
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