Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Roger Stout. To view the webinar, click here. Question: Was your dome house more expensive to build than conventional construction? Answer: Actually, not really. It was built 8 years ago, at a finished cost of about $100/sq.ft. (excluding property). At the time, that was low-end … [Read more...]
New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
Researchers at the Max Planck Institute of Colloids and Interfaces in Potsdam-Golm, Germany have developed a simpler and more cost-efficient means of creating microchips for electronics applications using paper and a conventional inkjet printer. The use of flexible, cost-efficient microchips as a replacement for silicon chips, which are more expensive and difficult to make, is … [Read more...]
Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion Systems
Parker Hannifin Corporation, a developer of motion and control technologies, has released new two-phase evaporative liquid cooling systems for renewable energy power conversion systems. “The Parker system’s inherent cooling efficiency benefits can result total system cost reductions of up to 15 percent, and/or enable up to a 33 percent increase in converter rated capacity … [Read more...]
New Finned Ceramic Heat Sinks Released
AMEC Thermasol has introduced a new range of slim finned ceramic heat sinks to complement the company’s existing range of flat- and wave-type ceramic heat sinks. According to the company, the addition of fins to the heat sink provides a larger surface area and an increase in power rating compared to flat-type heat sinks. … [Read more...]
New Tool Could Provide Better Understanding, Method for More Efficient Thermal Transfer
Researchers from the University of Toronto Engineering in Canada, with assistance from colleagues from Carnegie Mellon University in Pennsylvania, have published new insights into how materials used in electronics transfer heat, which could lead to smaller, more powerful electronic devices capable of more efficient thermal management. According to Dan Sellan and Professor … [Read more...]
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