Introduction Because of substantial increases in the power density of electronic packages over the past few decades, thermal interface resistance can comprise more than 50% of the total thermal resistance in current high-power packages [1]. Unless advanced thermal interface materials (TIMs) that achieve order-of-magnitude improvements in performance quickly emerge in the … [Read more...]
a case study to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications
Introduction Small-channel heat sinks provide an extremely compact and efficient vehicle for dissipation of large heat fluxes typically found in high power electronics. Fluid flow and heat transfer in small-sized channels, with hydraulic diameters on the order of a fraction of a millimeter (a few hundred micrometers), have been shown to behave similarly to conventional-sized … [Read more...]
Miniature Environmental Control Unit for Electronics
Aspen Systems has completed the development and military qualification of ECU-Chill™, a ruggedized refrigeration-based environmental control unit (ECU) for cooling electronics in mobile applications. ECU-Chill™ maintains sealed electronics enclosures at or below ambient temperatures, enabling Commercial-Off-The-Shelf (COTS) electronics to be safely and effectively used for … [Read more...]
Thermally Conductive Printed Circuit Board Substrate
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 … [Read more...]
Evaluation Method for Thermoelectrical Cooling Systems
IEC/TS 62610-3 ed1.0 -- Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect). IEC/TS 62610-3:2009(E) provides an evaluation method for thermoelectrical cooling systems (Peltier effect). With this design … [Read more...]
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