C&R Technologies (CRTech) has chosen SpaceClaim to be integrated within the CRTech family of products. CRTech SpaceClaim will address complexities in creating thermal models by enabling users to import CAD parts and assemblies from many CAD formats to simplify and heal the geometry and then send it on for meshing. CRTech SpaceClaim will also enable engineers to modify the … [Read more...]
Researchers Developing Silver-Diamond Thermal Shim
Researchers at the Georgia Tech Research Institute are developing a solid composite material, made of silver and diamond to cool small, powerful microelectronics used in defense systems. The diamonds provide the bulk of thermal conductivity, while the silver suspends the diamond particles within the composite and contributes to high thermal conductivity. The research is … [Read more...]
IP to the Pin a Major Trend in Software Technology
IP to the Pin is a software technology that will significantly influence automated test in the coming one to three years, according to National Instruments’ 2011 Automated Test Outlook, a view of key technologies and methodologies impacting the test and measurement industry. Sharing FPGA IP between design and test will dramatically shorten design verification/validation and … [Read more...]
New Material Provides Greater Thermoelectric Conversion Efficiency
Automobiles, military vehicles, even large-scale power generating facilities may someday operate far more efficiently thanks to a new alloy developed at the U.S. Department of Energy’s Ames Laboratory. A team of researchers at the Lab that is jointly funded by the DOE Office of Basic Energy Sciences, Division of Materials Sciences and Engineering and the Defense Advanced … [Read more...]
SEMI-THERM 27
March 20-24, San Jose, Calif. SEMI-THERM is an international forum dedicated to the thermal design and characterization of electronic components and systems. The symposium fosters the exchange of knowledge between practitioners and leading experts from industry, as well as the exchange of information on the latest academic and industrial advances in electronics thermal … [Read more...]
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