Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the multitude of materials and interfaces within an electronic package, the largest thermal resistance, and consequently the controlling … [Read more...]
The increasing importance of thermal test dies
Thermal test dies are among the major tools used in package thermal design qualification. They are usually simple chips, containing heaters and temperature sensors. The sensors measure the temperature on the chip surface as a result of the steady state powering or the time dependence of the temperature increase or decrease in case of transient qualification. From these data, … [Read more...]
The thermal conductivity of fluids
About 10-15 years ago, fluids, either directly (mainly Fluorocarbons), or indirectly (cold plates flushed with water) cooled the majority of mainframe computers. Nowadays, the expected increase in heat flux density causes a renewed interest in either passive or active liquid cooling, because the limits of air cooling come within reach. Other practical applications in which … [Read more...]
Thermal challenges in the telecom and networks industry
Figure 1: Telecom Equipment Operating EnvironmentsThere are two main reasons for doing thermal design in the telecommunication industry. The first is to ensure functionality of the equipment and system when subjected to extreme environments. The second is to ensure high dependability of the network. While doing thermal design, many challenges must be kept in mind: the … [Read more...]
A system level cooling solution for cellular phone applications
Improving thermal performance of electronic components is very challenging due to the increasing power density and decreasing module sizes. The design trade off between electrical and mechanical characteristics and the cost of manufacturing MCM products requires innovative solutions to improve device thermal performance. The primary cooling path in portable electronics serves … [Read more...]
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