Within the realm of CFD-based flow analysis, the presentation of data is a vital issue. Researchers and developers need to gain insight, and non-technical managers and commercial staff have a critical need to understand the true ramifications of the data. Unfortunately, current methods for visualizing flow have limitations that make it difficult to interpret vast quantities of … [Read more...]
Thermal interface under a plastic quad flat pack
Introduction Plastic components are designed so that the heat is dissipated by forced or natural convection. The use of plastic packages under conditions where neither cooling method is available introduces new challenges. High heat-dissipation plastic packages require a large-area solid heat sink in order to transfer the heat into the copper thermal lands on the printed … [Read more...]
Thermal management of handheld telecommunication products
Introduction Recent advances in mobile communications have enabled large scale development of handheld telecommunication products. Such products include cellular phones, pagers, two-way radios, personal digital assistants (PDAs), and other wireless and wireline equipment. The technological enhancements at device, package, and system levels have resulted in increased … [Read more...]
Experimental evaluation of the local convective heat transfer from configurations of wall-mounted cubes in a channel flow
Figure 1: Sketches of the measurement cube. Introduction Computational fluid dynamics (CFD) codes are frequently used as design tools to predict the thermal processes in electronic circuitry. CFD codes can easily cope with a high level of complexity (component, board and system levels) which makes them attractive to use. However, the thermal and kinematic complexity of the … [Read more...]
A simple method to estimate heat sink air flow bypass
Introduction After selecting or designing a heat sink based upon a given air velocity orvolumetric flow rate through the fins, the thermal designer needs to determinethe total amount of flow which must be delivered in the duct or card passagecontaining the module w with heat sink. As shown in Figure 1, some of the flowwill go around or bypass the heat sink. In fact, depending … [Read more...]
