Figure 1 Analog Devices LTM4700 combines high power with the energy efficient performance needed to reduce data center cooling requirements. To reduce data center infrastructure cooling requirements step-down DC/DC power regulators must combine high power with energy efficient performance. To that end Analog Devices has expanded its suite of Power by Linear … [Read more...]
New Way to Cool Data Center Chips Uses Laser Metal Printing
Figure 1: Researchers tested their technique by printing the Binghampton Univeristy logo with a 3D metal laser printer. Traditionally, electronics are cooled using a heat sink that transfers heat into the air or a liquid coolant. For the heat sink to work, it has to be attached to the CPU or the graphics processor via a thermal interface material, which helps facilitate the … [Read more...]
Making Electrothermal Co-Simulation a Reality
Taking on the challenge of placing ever more powerful electronics into increasingly small and complex devices has meant that electronic and thermal simulation are now vital parts of the engineering design flow. But with smaller geometries and higher power densities these challenges only get more acute. For starters the fact that the physical space within which electronic … [Read more...]
Balancing Local Versus Global Cooling Requirements
When you’re planning how to solve the ongoing problem of keeping things cool enough, it’s easy to mentally blur the lines between hot components and hot boxes. The difficulty is that the solution for one of these may not be adequate or appropriate for the other. Here’s the situation: in most systems, the heat sources are not distributed uniformly across the circuit board … [Read more...]
How My Electronics Should Be Oriented: A Thermal Point of View Study to Understand the Impact of Orientation on Internal Air Temperature
Authored by: Tejas Manohar Kesarkar and Nitesh Kumar Sardana Abstract— Modern day electronics work in varied thermal conditions. The increase in demand of electronics has led to miniaturization, use of plastic housing, and more applications from the existing electronics in the market. The model for analysis consists of multi-layered Cu-FR4 Printed Circuit Board (PCB) … [Read more...]
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