Water cooling gear manufacturer EK Water Blocks has released EK-FCTK20, a high performance full-cover water block that is reportedly the world’s first water cooling solution for the NVIDIA Tesla K20 series professional computing card. According to the company, the new water block “cools the GPU, RAM and VRM (voltage regulation module) as water flows directly over these … [Read more...]
Electronics Enclosure System Features Integrated Airflow Management Capabilities for Maximum Cooling, High Operating Efficiency
Eaton Corp., a developer of electrical systems for power quality, distribution and control, has released the RP series, a high-performance electronics enclosure system designed to house IT equipment in data centers of varying sizes. Available in 42U and 48U heights, the Eaton RP series cabinets feature easy installation and integrated airflow management capabilities capable of … [Read more...]
Apple Releases Software Update to Fix Fan Speed Problem in 2013 Retina MacBook Pro Models
Apple has released a new software update designed to combat the emerging problem that many consumers are facing with the cooling fans inside early 2013 Retina MacBook Pro laptops. According to a growing number of users posting on the official Apple support forums and reports from other websites, the fan inside the particular MacBook Pro model increases its speed to a potential … [Read more...]
Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains
Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for improved product quality and faster time-to-market benefits.” According to Mentor Graphics, the new software is … [Read more...]
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
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