Rittal Corporation has recently introduced a new refrigerant-based rack and row cooling solution, LCP DX, for heat removal of critical IT components. The Rittal Rack LCP DX “puts the cooling only where needed to protect valuable IT equipment while minimizing energy costs” and “includes air-flow optimized enclosures with includes baffles and blanking panels,” said the … [Read more...]
Revolutionary Structure Design Aids in Data Center Cooling
DAMAC, the leading U.S. manufacturer of data center infrastructure equipment, recently unveiled its DAMAC Structure during the Data Center World Global conference in Las Vegas. The structure incorporates an Aisle Containment System, which “encapsulates the aisle way and caps the end of the Structure with the door style of your choice [to] enable human access to the equipment … [Read more...]
Higher Temperature Rated MLC Capacitors Announced
Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC, NP0, Ceramic dielectric, with Ultra Low ESR; High Q, and Low Noise. Parts can now be operated up to +175°C with TCC of 0 ± 60 ppm/ºC (limited to +125°C at 0 ± 30 … [Read more...]
New Liquid Cooled HPC Cluster Launched
CoolIT Systems has successfully completed the second deployment of its Rack DCLC™ liquid cooling solution at the Poznan Supercomputing and Networking Center (PSNC) in partnership with Huawei. The liquid cooled solution is part of the HPC cluster known as “Eagle”, which is the second largest supercomputing installation in Poland according to CoolIT Systems. “The PSNC cluster … [Read more...]
Nominations Open for IEEE ITherm Achievement Award
The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research contributions, of service to the electronics thermal/thermo-mechanical management community, and of … [Read more...]
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