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Calculation Corner: Transient Thermal Modeling of a High-Power IC Package, Part 1

 

Part II can be found here. There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than in the past. As reliability requirements get more stringent there are growing concerns about the … [Read more...]

Efficient Electro-Thermal Simulation of Power Semiconductor Devices via Model Order Reduction

 

Thermal management is an increasingly important consideration in the development of power electronic systems. Electro-thermal simulation is required at the system level in order to ensure under realistic loads the fulfillment of thermal requirements, which strongly influence the performance, reliability and efficiency. A significant modeling issue is to obtain a compact but … [Read more...]

ElectronicsCooling Spring 2010 Print Issue

 

Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]

The Better Box Model

 

Introduction For the consumer, natural convection cooling or fan-less cooling is the method of choice. It is silent, it is reliable, it is simple, and it is environmentally sound because no additional energy is used to remove the excess heat. For the thermal engineer, fan-less cooling is more problematic. On the plus side, no fan is needed, so there is an attractive cost … [Read more...]

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