The global market for Electronic Thermal Management is forecast to reach $8.6 billion by 2015, according to market research company Electronics.ca Publications. Factors driving growth include developments in technology and marked increase in the production of miniaturized microprocessors. Further, increased use of mobile devices is likely to impact market growth. In the … [Read more...]
TECs for Larger Heat Pumping Applications
Nextreme Thermal Solutions recently introduced the eTEC HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements. At 85°C, the eTEC 0.6mm-high HV56 can pump 6 watts or 58 W/cm2 of heat in footprint of only 11 mm2. At 85°C, the eTEC HV56 can … [Read more...]
Handbook Provides Tutorial for Thermoelectric Module Operation
Laird Technologies, Inc. has released its revised “Thermoelectric Handbook.” Available for download from the Laird website, the handbook provides insight into understanding the basic structure and function of TEMs, parameters required for device selection, assembly tips for mounting TEMs onto heat exchangers, and available temperature control options. Designed for engineers … [Read more...]
A Simple Method to Estimate the Physical Characteristics of a Thermoelectric Cooler from Vendor Datasheets
Introduction A thermoelectric cooler (TEC) is a solid-state refrigerator that operates on the Peltier effect. The absence of moving parts, compact size, precise temperature control ability and reliability all combine to make the TEC a unique refrigerator. TECs find application [1, 2] in many fields from simple food and beverage coolers for an afternoon picnic to extremely … [Read more...]
Effect Of Improved Thermoelectric Zts On Electronic Module Coolability
In recent years there has been a growing interest in the application of thermoelectrics to electronics cooling. Attention has been focused on thermoelectric cooling both as a possible means to enhance module cooling and to address the chip hot spot problem. Effort has been directed towards the development of new bulk materials and thin film micro-coolers. The usefulness of … [Read more...]
