Silicon-based technology developer Dow Corning has released new dispensable thermal pads for more cost-effective thermal management in LED lighting applications. The new dispensable thermal pads “enable LED lamp and luminaire manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes … [Read more...]
Thermal Adhesive Tape for Application to Unprocessed PCBs
Thermal management materials manufacturer Universal Science has introduced a new thermal adhesive tape designed to be applied to FR4 or insulated metal substrate printed circuit boards (PCBs) prior to processing as a replacement for mechanical fixings. Featuring a thermal conductivity of 2.0 W/mK and a breakdown voltage (electrical isolation) of 4 kV AC, Bondline 2000-REFLOW … [Read more...]
Data Center Coolant Distribution System
Rittal Corporation, a manufacturer of industrial and IT enclosures, racks and accessories, has released a new coolant distribution system for use with Rittal’s rack- or door-mounted liquid cooling packages (LCP). Designed to handle all water routed between adjacent chillers and rack- or door-mounted LCPs, the new distribution unit is available with either four- and eight-tap … [Read more...]
Phase-Change Material Offers Alternative Thermal Management Solution to Thermal Grease
Universal Science, a manufacturer of thermal management materials, has introduced UniPhase 3500, a new phase change material that combines a high level of thermal performance and a thin bond line into an ideal solution for designs where a high degree of heat transfer is required over large surface areas. According to the company, UniPhase 3500 is a silicone-free material that … [Read more...]
Liquid Silicone Adhesive Offers High Thermal Conductivity for Bonding Electronic Components
The Bergquist Company, a manufacturer of high-performance thermal management materials, has released Liqui-Bond SA 3505, a two-component, liquid silicone adhesive ideal for power supplies and discrete applications. With a high thermal conductivity of 3.5 W/m-K, Liqui-Bond SA 3505 offers a thermal conductivity previously unavailable in a structural adhesive, the company said. … [Read more...]
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