Intermark offers thermal interface materials (silicone based, silicone free, EMC and Thermal management dual function types), heat spreader sheets, thin thermal tape, and other solutions to improve the heat management of any application including LED Lighting, laptops, routers, cell phones, medical equipment, solar, and automotive components. Intermark’s line of products for … [Read more...]
Gap Fillers and Thermal Greases on Display at SEMI-THERM
Fujipoly will be at SEMI-THERM showcasing its Sarcon® 50G-Hm high performance, low resistance gap filler pad, Sarcon® GR-SL low compression thermal gap filler material, and Sarcon® SG-26SL silicone-based thermal grease. The Sarcon® 50G-Hm is manufactured with a special low-tac top surface. The one-sided treatment is less sticky than the opposing surface allowing the thermal … [Read more...]
High Temperature Felt and Millboard Ideal for Industrial Appliances
Morgan Thermal Ceramics announces the availability of its Superwool® HT™ Felt and Superwool® HT™ Millboard, ideal for fabricating gaskets and heat shields for industrial appliances, including ovens, fryers and cooking equipment. The lightweight, multi-purpose products are available in a full range of sizes, thicknesses and densities and offer equivalent performance to … [Read more...]
Thermal Fuse Series Meets High Current Application Requirements
In response to market demand for applications requiring thermal cut-outs with high current capabilities, Selco Products has introduced the SWTC3 Thermal Fuse Series. The SWTC3 features a 20 Amp rating at 120/250VAC and is suited for use in a wide range of applications. Selco’s new SWTC3 and original SWTC (10 Amp continuous duty rated) thermal cutoffs are designed to provide … [Read more...]
Thin Label Material Made of 0.5 Mil Polyimide Film
Polyonics has designed an ultra-thin, white coated, polyimide label material that uses a 0.5 mil film for space constrained electronics. The XF-616 is a high temperature, thermal transfer printable material with an aggressive acrylic adhesive to insure superior bond permanence. This label material is designed to provide a 20% lower profile and survive the harsh environments of … [Read more...]
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