The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Sheraton Hotel & Marina in San Diego, CA, May 31 – June 3, 2022. This was the 21st ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule. ITherm 2022 was sponsored by … [Read more...]
Thermal Modeling of a Silicon Germanium (SiGe) Radio Frequency Integrated Circuit (RFIC) for Wireless Communications
The creation, transport and storage of digital information are growing at rates of 40% to 50% annually, with video, mobile broadband, and machine-to-machine communication being the main drivers. The implementation of 5G wireless networks is enabling this growth and heralding a new era of revolutionary applications and functionality due to bandwidth increases and communication … [Read more...]
Statistics Corner: Modifying Sample Size
ABSTRACT Reliability verification often requires that a specific number of components be tested to a predetermined level of testing to demonstrate that none of the samples fail. This article describes a statistical approach for justifying the use of fewer samples by subjecting them to a more severe level of testing. BACKGROUND Reliability verification often includes … [Read more...]
Statistics Corner: Probability
Statistical analysis is needed because data always have some degree of uncertainty; a value that we determine from a single measurement, or even set of measurements, is not necessarily going to tell us exactly what value we will determine with additional measurements. Statistical analysis uses the mathematics of probability to create tools that we can use to deal with … [Read more...]
Ultra Low Thermal Resistant Adhesives for Electronic Applications
Sponsored by Master Bond As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges adhesives are uniquely qualified to meet … [Read more...]
- « Previous Page
- 1
- …
- 6
- 7
- 8
