A new lead-free, high temperature ceramic capacitor developed by scientists at the National Physical Laboratory (NPL), UK could improve the efficiency and reliability of electric and hybrid vehicles by enabling the removal of heavy complex cooling systems. “Electric vehicle operating temperatures can go up to 140°C [almost double the temperature conventional capacitors can … [Read more...]
GE Announces Dual Piezoelectric Cooling Jet Manufacturing Partnership
General Electric has announced a partnership with semiconductor company Texas Instruments to manufacture the company’s dual piezoelectric cooling jet technology first unveiled in December 2012. According to General Electric, the dual piezoelectric cooling jet technology is a new energy-efficient method for cooling consumer electronics that is based on technology used to … [Read more...]
New Cooling Method Based on Military Fighter Jet Air Flow Technology
Engineers at GE Global Research have unveiled a new method of moving air in order to cool consumer electronics based on technology used to improve air flow in military fighter jets. Tentatively known as a “dual piezoelectric cooling jet,” the technology consumes an average of 50 percent less energy than modern fan-powered cooling units. According to Dr. Seyed Saddoughi, … [Read more...]
High Temperature Felt and Millboard Ideal for Industrial Appliances
Morgan Thermal Ceramics announces the availability of its Superwool® HT™ Felt and Superwool® HT™ Millboard, ideal for fabricating gaskets and heat shields for industrial appliances, including ovens, fryers and cooking equipment. The lightweight, multi-purpose products are available in a full range of sizes, thicknesses and densities and offer equivalent performance to … [Read more...]
30 GHz Leadless Chip Carrier Packaging Platform
Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for supporting demands for broadband (DC to 30 GHz), low pin-count ASIC … [Read more...]
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