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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense

 

By: Dr. Alexander Yatskov; Thermal Form & Function Inc.  Introduction  Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]

Circuit Credit Card Assembly Heat Sinks Embedded with Oscillating Heat Pipes

 

Joe Boswell, Chris Smoot, Elliot Short, Nate Francis   Introduction  In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies (CCA). OHP-embedded heat sinks efficiently transport heat generated by CCA centrally located components to the assembly’s … [Read more...]

Advances in Vapor Compression Electronics Cooling

 

INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices.  As this­­ energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]

Self-Ventilating Heat Exchanger Cools Sealed Compartments without Contamination

 

AMETEK Rotron has introduced the new Discus self-ventilating heat exchanger designed to cool sealed airborne or ground-based electronic and optical compartments without introducing contaminated external air. Ideal for pod-mounted airborne optical systems, the Discus can also be used to cool other aircraft, helicopter, drone and ground-based electronics requiring air … [Read more...]

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