Sandia National Laboratories has developed a proprietary air-cooling invention, the “Sandia Cooler,” also known as the “Air Bearing Heat Exchanger.” The Sandia Cooler technology, which is patent-pending, will significantly reduce the energy needed to cool the processor chips in data centers and large-scale computing environments. In a conventional CPU cooler, the heat transfer … [Read more...]
Honeycomb Heat Sink Utilizes Science of Real Honey Bees
Utilizing the science of real honey bees, JaroThermal's newest Honeycomb heat sink directs heat towards the outside, while producing a steady flow of cool air on the inside. A multi-holed design and increased surface area optimizes cross ventilatation, while simulatanously cooling the surrounding ambiant air. Applications include a wide range of cooling solutions for video … [Read more...]
Forced Convection Heat Sink Thinner than a Credit Card
Novel Concepts, Inc. has developed and has patents pending for the world's thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs and other microelectronic heat generating devices. ThinSink has an amazing thermal performance of 2.73°C/W (degrees Centigrade per … [Read more...]
Thermally Conductive Grease Used for Solar Industry
A product that is proving useful to the solar industry is LORD Corporation’s TC-501 Thermally Conductive Grease. This solvent-free, silicone thermal interface material (TIM) is designed to replace greases used as TIMs between the heat spreader and the heat sink (commonly known as TIM2). It provides high thermal conductivity and low thermal resistance for applications where … [Read more...]
Connector/Decoupler Integrated in a Heat Sink
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from each other and function as radiators that dissipate heat from the stacked semiconductor chips. Conductive wiring structures are formed on each set of … [Read more...]
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