United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from each other and function as radiators that dissipate heat from the stacked semiconductor chips. Conductive wiring structures are formed on each set of conductor fins to supply electrical power and electrical grounding to the stacked semiconductor chips. Since the semiconductor fins above provide electrical power supply and electrical grounding, a higher fraction of electrical connections between the bottommost surface of the stacked semiconductor chips and the packaging substrate may be employed for input and output signal transmission without adverse impact on heat dissipation of the stacked semiconductor chips. The conductive fins function as power connectors.