Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
May 3, Boxborough, Mass.
• New for 2011 “Big Red’s Marketplace” An Incubator Area of Table Top Spaces for FIRST TIME EXHIBITORS
• Plus Our Fully Carpeted Exhibit Hall with Sixty 8’x10’ Booths – Click for Exhibitor Registration
• 38th Annual Symposium – “Greatest Symposium & Expo on Earth” Theme
• Expanded Technical Program: 8 Sessions with 36 Speakers & 11 Posters – Click for Full Program
• Numerous Sponsorship Opportunities
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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