In past issues of Electronics Cooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels formed between the fins. As noted in the second article this is often not the case and much of the … [Read more...]
Cooling Technology Options
(Editor's Note: Part 2 of this article will appear in the November 2003 issue of ElectronicsCooling.) Cooling electronic systems is one of the major focal points of the design process and the key to a successful product launch. Many options to attain successful operation are available, ranging from passive cooling to cryogenics. These options are obviously power dissipation … [Read more...]
Estimating Parallel Plate-fin Heat Sink Pressure Drop
In the last issue of ElectronicsCooling a methodology was presented for estimating parallel plate-fin heat sink thermal resistance [1]. The method presented assumes that the air flow rate is given, either in terms of the average velocity, V, between the fins or a volumetric flow rate, G. Although this methodology was shown to be useful in examining the effects of heat sink … [Read more...]
How Much Heat can be Extracted from a Heat Sink?
Thermal transport from a heat sink creates a unique condition in heat transfer and fluid flow once it is placed on a PCB in an unducted fluid flow delivery system. Although a heat sink may appear structurally simple, the fluid flow through its fin field and thermal coupling between it and the surrounding create a rather complex problem. As a result, heat sinks are often … [Read more...]
Estimating Parallel Plate-Fin Heat Sink Thermal Resistance
As noted previously in this column, the trend of increasing electronic module power is making it more and more difficult to cool electronic packages with air. As a result there are an increasing number of applications that require the use of forced convection air-cooled heat sinks to control module temperature. An example of a widely used type of heat sink is the parallel plate … [Read more...]
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