Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for a given heat load and heat transfer coefficient. The formula to estimate the heat dissipation capability, qf, of a straight fin is given by, and Af is … [Read more...]
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
Introduction Due to the increasing power density in today's industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and the memory modules. The system level fan speeds are directly dictated (in most cases) by both processor and memory temperatures. Due to the fact that … [Read more...]
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or wall-mount base stations and radio units, include external fins to improve natural convection and radiation heat transfer rates. Early … [Read more...]
Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers
Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner article will address the use of interdigitated fins to provide a mechanically tolerant thermal path between two opposing surfaces (e.g., the back … [Read more...]
Design For Manufacturability Of Forced Convection Air Cooled Fully Ducted Heat Sinks
Introduction The requisite thermal management for a microprocessor is most often achieved via an aluminum heat sink (fin structure) and a small fan. The effort discussed herein deals with the development of a 'design for manufacturability' methodology for forced convection cooled, plate fin arrays used to form high performance heat sinks for electronics cooling applications. In … [Read more...]
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