Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal resistances: ΘJC , the junction-to-case thermal resistance for the package, ΘCS , the case-to-sink thermal resistance representing the thermal interface material (TIM) between the … [Read more...]
High Powered Chip Cooling — Air and Beyond
Introduction Over the past few years many people in the electronics industry have become concerned with the increases in heat density at both the chip and module level of packaging. This trend is not new and has been with us since the days of bipolar chips. As can be seen in Figure 1, the heat flux associated with bipolar circuit technologies steadily increased from the … [Read more...]
Metals For Thin Wires – Criteria Of Choice
When a designer has to deal with thin current-carrying wires, a number of thermal issues pop up: Joule heating, heat losses and temperature measurement. For standard lead wires, one usually wants minimal Joule heating and minimum thermal resistance (in order to maximize the heat losses). Minimization of heat losses may be important for a research environment. Maximum Joule … [Read more...]
Vibration Analysis For Electronic Equipment
This topic is rather esoteric and usually an afterthought in commercial and industrial applications. In military and defense electronics, it is one of the major drivers for design and product architecture early on in the design cycle with specific targets/budgets. As with junction temperature requirements in a thermal design, there are structural dynamic issues that need to be … [Read more...]
"Revolutionary" New Thermal Management Materials
Editors tend to frown on use of "revolutionary" in technical papers. However, advances in thermal management material properties in the last few years clearly warrant this word. There are now over a dozen materials with low coefficients of thermal expansion (CTEs) and thermal conductivities higher than that of copper (400 W/m K), and a score with thermal conductivities at least … [Read more...]
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