Thermattach thermally conductive adhesivetapes Introduction Today's semiconductors, whether discrete power or logic ICs, are smaller,run faster, do more and generate more heat. Some microprocessors dissipatepower levels that were once the exclusive domain of discrete power devices,namely 10 to 25 watts. These power levels require thermal management techniquesinvolving large … [Read more...]
Thermal resistance of interface materials as a function of pressure
A very large factor in reducing thermal interface resistance is theapplication of pressure. Even though much effort in recent years has beendevoted to improving the thermal conductivity of interface materials, thethermal conductivity of a material is only a piece of the heat transfer puzzle.As shown in Figure 1, the thermal resistance created by the material itself(RM) for a … [Read more...]
Thermal conductivity of printed wiring boards
The thermal management of printed circuit boards is of increasing importanceas the power density of components and circuits continues to rise. Thesituation is complicated by the use of boards with multiple sheets of copperembedded in the electrically insulating boards to provide electromagneticshielding and to allow more three-dimensional connectivity of the circuitry bythe use … [Read more...]
