This topic is rather esoteric and usually an afterthought in commercial and industrial applications. In military and defense electronics, it is one of the major drivers for design and product architecture early on in the design cycle with specific targets/budgets. As with junction temperature requirements in a thermal design, there are structural dynamic issues that need to be … [Read more...]
"Revolutionary" New Thermal Management Materials
Editors tend to frown on use of "revolutionary" in technical papers. However, advances in thermal management material properties in the last few years clearly warrant this word. There are now over a dozen materials with low coefficients of thermal expansion (CTEs) and thermal conductivities higher than that of copper (400 W/m K), and a score with thermal conductivities at least … [Read more...]
Phase Change Material Thermal Properties
Table 1. General Solid-Liquid PCM Characteristics [1] When electronics are operated under transient conditions, increasing the thermal capacitance is a useful technique for limiting temperature increases and/or minimizing the performance requirements of a heat sink. One effective method of increasing thermal capacitance is to include a material that undergoes a change of … [Read more...]
Solve Thermal Issues Earlier in Updated Board Designs
Introduction Often new products or product concepts only introduce some new aspects and rely heavily on existing designs. At the board level this often means only one section of a board is retooled or upgraded; an approach that can save significant time and money. Unfortunately, we cannot rely solely on previous work because the interaction of old functions and new features … [Read more...]
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins and spread the heat beyond the package footprint and enhance heat transfer to the air. Heat can flow into these planes by conduction either … [Read more...]
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