The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic speeds, cost, reliability and size have been improved, but, unfortunately, packaging and thermal management have not followed at the same … [Read more...]
Thermomechanical stress modeling in microelectronics and photonics
Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated with mechanical (structural) failures (e.g., ductile rupture, brittle fracture, failures due to fatigue, … [Read more...]
Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate
Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is what results when a fan is not used in the cooling design to move air. Instead, movement of the air is induced by … [Read more...]
The Anisotropic Thermal Conductivity of Plastics
The easiest way to tailor thermal conductivity of plastics is to incorporate some highly thermal conductive filler material into the plastic molding compound. Here the filler particles act as heat carriers in the thermally isolating media. Roughly, if more filler is used, then higher thermal conductivity is achieved. Phenomena related to manufacturability and strength often … [Read more...]
The Challenge of Operating Computers at Ultra-low Temperatures
Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance. But as minimum feature size passed well into the sub-micron and now into the nanometer region, this route to higher performance has … [Read more...]
- « Previous Page
- 1
- …
- 333
- 334
- 335
- 336
- 337
- …
- 358
- Next Page »
