An earlier work by the authors (Molki et al., 1995) discussed the adiabatic heat transfer coefficient of rectangular blocks situated in an in-line array. In real circuit boards, heat is generated by a number of electronic components. The temperature of each component is affected by two factors, self-heating and thermal wake effect. Self-heating is the temperature rise due to … [Read more...]
Thermal challenges in the telecom and networks industry
Figure 1: Telecom Equipment Operating EnvironmentsThere are two main reasons for doing thermal design in the telecommunication industry. The first is to ensure functionality of the equipment and system when subjected to extreme environments. The second is to ensure high dependability of the network. While doing thermal design, many challenges must be kept in mind: the … [Read more...]
Thermal conductivity of composite materials
A composite material can be defined as a material in which two or more different materials are bonded together. It is sensible to make a distinction between macrocomposites and microcomposites. The first group usually has a layered structure, and PCBs are the main application. The second group looks uniform to the naked eye; materials from this group are often used for packages … [Read more...]
Thermal analysis moves into the 21st century
In the last decade, we've come a long way in the application of thermal analysis to the design of electronics. And there's no sign of the pace of innovation changing. Engineers are still being challenged to build faster, smaller and cheaper products in ever-decreasing design times. Fortunately, the engineering software industry has been able to respond by providing tools that … [Read more...]
Computer-related thermal packaging at the millenial divide
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as a key enabling technology in the development of advanced microelectronic systems and has facilitated many of the "Moore's Law" [Moore, G.E., 1975] … [Read more...]
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