Science-based company Royal DSM has released PET XL-T, a thermoplastic polyester for thermal management in LED lighting systems and automotive electronics components. According to the company, Arnite PET XL-T was developed as an alternative to metals and other high heat resistance (HHR) materials commonly used in automotive electronic applications. The new polyester is based … [Read more...]
Firm Opens 2nd Consumer Electronics Production Facility in China
Indianapolis, Ind.-based Marian, Inc., recently opened another facility in China. Located in the Chaohuilou Technology Industrial Park in Dalang, Longhua, Shenzhen in the Guangdong province, the engineering and manufacturing facility features a 2,700 square meter building. Marian Shenzhen brings high-tech jobs and university-trained engineers to the area in laser die cutting, … [Read more...]
Technical Data Summary
ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging and as a result, this column will evolve into additional topics. … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part II
In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In higher-power applications it is often necessary to attach a heat sink to the top of the package to keep the junction temperature of the chip within specified limits. … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part 1
One of the primary tasks of the thermal engineer is to determine the temperature of the junction (active circuitry on an integrated circuit) for the various packages in a system. Measurements performed in the industry-standard test environment are often used in this endeavor. The most common thermal metric [1,2] is the junction-to-air thermal resistance, JA (pronounced theta, … [Read more...]
