Saint-Gobain Ceramic Materials has released its new CarboTherm boron nitride thermal management fillers for use in thermally conductive, dielectric plastic compounds. The new boron nitride fillers will be on display December 10-11 at the Compounding World Forum 2013 in Philadelphia, Penn., USA. “Boron nitride, unlike other ceramics, is soft and non-abrading, enabling longer … [Read more...]
Thermoplastic Polyester for Thermal Management in LEDs and Electronic Components
Science-based company Royal DSM has released PET XL-T, a thermoplastic polyester for thermal management in LED lighting systems and automotive electronics components. According to the company, Arnite PET XL-T was developed as an alternative to metals and other high heat resistance (HHR) materials commonly used in automotive electronic applications. The new polyester is based … [Read more...]
Firm Opens 2nd Consumer Electronics Production Facility in China
Indianapolis, Ind.-based Marian, Inc., recently opened another facility in China. Located in the Chaohuilou Technology Industrial Park in Dalang, Longhua, Shenzhen in the Guangdong province, the engineering and manufacturing facility features a 2,700 square meter building. Marian Shenzhen brings high-tech jobs and university-trained engineers to the area in laser die cutting, … [Read more...]
Technical Data Summary
ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging and as a result, this column will evolve into additional topics. … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part II
In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In higher-power applications it is often necessary to attach a heat sink to the top of the package to keep the junction temperature of the chip within specified limits. … [Read more...]
