Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC package thermal characterization apply only to single-chip packages. This Calculation Corner will present some techniques for calculating the junction … [Read more...]
There's something for everybody on talk radio
I was doing my Sunday morning (2 a.m.) radio call-in show about electronics cooling (Hot Air on the Air with Tony K), when I heard a familiar voice on the line. "Herbie in Hereford," I greeted the caller, "You're on the air with Hot Air." "First time caller, long time listener . . .," the caller said. "Wow. There must be an insomnia epidemic," I interrupted. Johnny, the … [Read more...]
Flash Diffusivity Method: A Survey of Capabilities
The development, specification, and quality control of materials used in electronics packaging and thermal management often require the measurement of thermophysical properties.This data can be critical to a successful design, especially with the rapidly increasing cooling requirements that result from the packaging of higher performance devices. A variety of methods, involving … [Read more...]
The Thermal Conductivity of Thermal Insulators
This issue, we present an overview of a number of materials that are often used as thermal insulators. The world would have been much easier for thermal engineers if only the creator had provided us with a choice of materials showing the same range in thermal conductivity values as exists for electrical conductivity. Alas, this isn't the case. Thus, not a single one of the … [Read more...]
The Many Flavors of Ball Grid Array Packages
By now, it is a tired truism to say that the consumer electronics industry has consistently delivered on its promise to provide products that are smaller, faster, and more feature-rich at an ever cheaper price. The main driver for these trends has been the increasing integration of more functions on a single chip. In spite of its greater performance, the PC of today has far … [Read more...]
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