Microsoft, who manages more than 100 data centers around the world, has completed testing of a self-contained data center prototype that can operate hundreds of feet below the surface of the ocean. The New York Times reported that the prototype was a “large white steel tube, covered with heat exchangers, with its ends sealed by metal plates and large bolts” and “a single data … [Read more...]
Protection Coatings for Coolers to be Presented at Upcoming Conference
On February 26 at the Photonics West Conference in San Francisco Rogers Corporation’s Power Electronics Solutions (PES) will be presenting a report on ACT’s vapor-deposited Applied Nanoscale Corrosion Resistant (ANCER™) coatings in partnership with Advanced Cooling Technologies. According to the company, the thin, conformal ANCER coatings “help extend the operating life of … [Read more...]
Solder Joint Lifetime of Rapidly Cycled LED Components
Wendy Luiten Philips Research, Eindhoven, the Netherlands INTRODUCTION Active LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of the LEDs is a powerful means to improve visual experience, either through application of active LEDs in an ambient light feature, or through dimming and boosting of the display LEDs in a … [Read more...]
Challenges in Measuring Theta jc for High Thermal Performance Packages
Jesse Galloway and Ted Okpe Amkor Technology One of the more challenging thermal resistance measurements to make for electronic packages is the junction-to-case resistance called Theta jc. The equation for Theta jc, equation (1), is straightforward. However, the difficulty lies in making an accurate case temperature, Tc, without affecting the junction temperature, Tj, and the … [Read more...]
Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package
Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other discrete components on a common substrate. For accurate thermal analyses of MCPs, thermal interactions between active components need … [Read more...]
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