Omega’s new NEP-TX series of molten metal ceramic sheath thermocouples features a 1250 degrees Celsius (2282 degrees Fahrenheit) temperature rating, connection head with terminal block and corrosion resistance. Standard construction includes cast iron NEP-TX connection head and 1 ¼ NPT fitting. Learn more from Omega. … [Read more...]
IBM Retiree Wins Award from Engineers Society
Robert E. Simons was named the 2011 winner of the Allan D. Kraus Thermal Management Medal given recently by the committee that manages the annual award for the American Society of Mechanical Engineers. Simons is a retired IBM senior technical staff member who has had a 45-year career in the management of heat in electronics and holds more than 130 patents. He joined IBM in 1966 … [Read more...]
New Capacitors with Low Insertion Height
TDK-EPC has developed a wide range of EPCOS MKP and MKT film capacitors with low insertion heights. The new capacitors with a lead spacing of 37.5 mm feature insertion heights of only 15 or 19 mm. These components are designed for rated voltages of between 63 and 2000 V DC or 250 to 400 V AC. Their capacitance ranges from 0.1 to 82 µF. Depending on type and technology (MKT or … [Read more...]
Carbon Nanotubes as Conductive Material for Through-Silicon Vias
A research team at Chalmers is working with carbon nanotubes as conductive material for through-silicon vias. Carbon nanotubes are going to be the most reliable of all conductive materials if it is possible to use them on a large scale. This is the opinion of Kjell Jeppsson, a member of the research team. The researchers have demonstrated that two chips can be vertically … [Read more...]
New Method for Enhancing Thermal Conductivity Could Cool Computer Chips
The surprising discovery of a new way to tune and enhance thermal conductivity gives engineers a new tool for managing thermal effects in smart phones and computers, lasers and a number of other powered devices. The finding was made by a group of engineers headed by Deyu Li, associate professor of mechanical engineering at Vanderbilt University. Li and his collaborators … [Read more...]
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