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Safety tips and techniques for FEA in modeling solids

June 1, 1995 Tony Rizzo

Using commercially available finite element analysis (FEA) software is easier today than it has ever been. Software vendors have made great progress toward providing programs that are as easy to use as they are powerful. But, in doing so, software suppliers have created a perilous quagmire for unwary users. Some engineers and managers look upon commercially available FEA … [Read more...]

june

2jun - 6jun 21:00 amjun 6Design Automation Conference (DAC)

27jun - 29jun 271:00 amjun 2926th International Conference: Mixed Design of Integrated Circuits and Systems

Event Details

The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to invite you to Rzeszow.

The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators, and power devices.
The MIXDES conference papers are indexed in INSPEC and available in IEEE Xplore.

The topics of the MIXDES Conference include:

Design of Integrated Circuits and Microsystems
Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
Thermal Issues in Microelectronics
Thermal and electro-thermal modeling, simulation methods and tools. Thermal mapping. Thermal protection circuits.
Analysis and Modelling of ICs and Microsystems
Simulation methods and algorithms. Behavioral modeling with VHDL-AMS and other advanced modeling languages. Microsystems modeling. Model reduction. Parameter identification.
Microelectronics Technology and Packaging
New microelectronic technologies. Packaging. Sensors and actuators.
Testing and Reliability
Design for testability and manufacturability. Measurement instruments and techniques.
Power Electronics
Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
Signal Processing
Digital and analog filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
Embedded Systems
Design, verification, and applications.
Medical Applications
Medical and biotechnology applications. Thermography in medicine.

https://www.mixdes.org/Mixdes3/

Time

27 (Thursday) 1:00 am - 29 (Saturday) 1:00 am

Location

Rzeszów, Poland

Calendar GoogleCal

july

9jul - 11jul 91:00 amjul 11SemiconWest

Event Details

SEMICON West is where the industry goes to keep up with developments in a world that is rapidly moving BEYOND SMART — and where it goes to find the information and resources it needs to keep the good times rolling.

Why SEMICON West?

Three days of presentations with more than 80+ hours of technical and business programming, plus hundreds of exhibitors provide the insights, innovations, and intelligence you need to get ahead and embrace today’s disruptive landscape.

From materials, equipment, design, manufacturing, system integration, and demand channels to new verticals and adjacencies such as Flexible Hybrid Electronics, MEMS & Sensors, you’ll gain access to the best in the business and get a glimpse at what’s next. Immersive, new experiences demonstrating hot-buttons like Smart Transportation, Smart Manufacturing, MedTech, Big Data, IoT, and the cognitive technologies that are transforming the world make this year’s Expo like no other before.

Make the connection.

SEMICON West connects the entire extended electronics supply chain — in one place, at one time. It’s the premier place to re-connect with your contacts and make new ones to drive your business forward. With all-new networking events, three new “Meet the Experts” Theaters, and new immersive Smart Pavilion experiences, this year’s Expo will help you connect with more qualified customers and partners than ever before.

Who Should Attend?

Business and technology leaders, researchers, and industry analysts from across the microelectronics supply chain, including:

Manufacturing Equipment
Materials
Components
Packaging
Assembly & Test
Design/Fabless
MEMS and Sensors
Flexible Hybrid Electronics (FHE)
IC Device Applications
Systems Integrators
IoT and Consumer Electronics Manufacturers

Engineers
Technicians
Scientists
Supply Chain
Managers
Marketing & Sales
Business Managers
Field Services
EH&S
QA/QC
Executives.

http://www.semiconwest.org/

Time

9 (Tuesday) 1:00 am - 11 (Thursday) 1:00 am

Location

Moscone Center

Moscone Center, San Francisco, CA

Calendar GoogleCal

september

5sep - 6sep 51:00 amsep 631st Annual Electronics Packaging Symposium

Event Details

GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium- Small Systems Integration.

We invite you to join us for this two-day event on September 5-6, 2019 at GE Research Center in Niskayuna, NY.

This symposium brings together leaders in academia, industry, and government to discuss the current standing in the field of electronics packaging, and bring value from the varying viewpoints of each respective sector.

There are many pressing challenges that are found within this field as of today, and this symposium provides the grounds to discuss these pressing concerns in both the technical aspect, as seen in the session topics below, and larger scale aspect of market trend and future direction.

The program will also include workshops, student poster sessions, and exhibits to share and spread knowledge, and ultimately have those who attend walk away with invaluable knowledge, added value in career building opportunities, and has become an integral member in advancing the field of electronics packaging.

Session topics for 2019 :

2.5/3D Packaging
5G Needs in Packaging
Automotive & Harsh Environments
Bioelectronics
Flexible & Additive Electronics
Materials for Packaging & Energy Storage
MEMS
Photonics
Power Electronics
Sensors, Embedded Electronics & IoT
Thermal Challenges
Wearable and Flexible Electronics for Medical Applications

We hope to see you there.

https://www.binghamton.edu/ieec/symposium/index.html