Aluminum Oxide (Al2O3) is an important ceramic for the electronics industry. Besides its use as a passivation layer on Silicon, the ceramic is often used as a carrier for thick and thin film passive components and for other small printed circuit boards. A relatively low cost is combined with a relatively high thermal conductivity, especially when compared to FR4 board material. … [Read more...]
Thermal characterization of active components
In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), the methods for thermal characterization of active components developed in the predecessor DELPHI (Development of Libraries of PHysical models for an Integrated design environment) were evaluated by component suppliers. The methods were improved for practical application and extended to a large … [Read more...]
Uncertainty analysis
Uncertainty analysis is the process of estimating the uncertainty in a result calculated from measurements with known uncertainties. Uncertainty analysis uses the equations by which the result was calculated to estimate the effects of measurement uncertainties on the value of the result. Uncertainty analysis is used in the planning stages of an experiment to judge the … [Read more...]
Use of junction-to-board thermal resistance in predictive engineering
The readers of "Electronics Cooling" are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you realize that vendors cannot continue to state the integrated circuit will work at a specified ambient temperature (55°C, 70°C, 85°C, or 125°C) as device … [Read more...]
Acoustic noise emission and communication systems in the next century
Acoustic noise emission is one of several physical design issues addressed during the design of telecommunications and information technology equipment. In most systems, noise is a by-product of the air-movers used for system cooling. The amount of heat dissipated in electronic systems cooled by forced convection is directly proportional to volumetric flow rate. The flow rate, … [Read more...]
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