by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
New “Form-In-Place” Product with Process Demonstration Video
JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech PLC is engaged in providing creative solution to improve the reliability of electronics equipments. Established in … [Read more...]
Nominations Open for IEEE ITherm Achievement Award
The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research contributions, of service to the electronics thermal/thermo-mechanical management community, and of … [Read more...]
New Higher-Speed Interface for Thermographic Camera
InfraTech has recently released its new 10 Gigabit Ethernet interface for their ImageIR® thermographic camera series. The 10 Gigabit Ethernet interface has “high-speed imaging allowing microsecond exposure times that freeze the apparent motion of dynamic events,” according to the company, and transfers data “ten times faster than a GigE interface”, thanks to a network card … [Read more...]
Graphene Can Now Be Applied to Thermal Imaging Devices
Researchers from MIT have built a chip out of graphene that could be applied to thermal imaging devices. “Graphene is one of the best-known infrared sensing materials, so the team built a microscopic sensor chip out of the material,” Engadget reported. “Further graphene was then used to carry the signals and suspend the chip over an air pocket. That eliminated the need for … [Read more...]
