Electronics Packaging Symposium

The 30th annual Binghamton University and GE Electronics Packaging Symposium, the premier electronics manufacturing conference in the Northeast, features more than 40 invited technical presentations by academic, industry, and government leaders, influencers, and decision makers. The program includes an IEEE Electronics Packaging Society-sponsored workshop on Heterogeneous Integration, a student poster session and exhibits.

 

Session topics will include:

• 2.5/3D packaging

• 5G needs in packaging

• Automotive and harsh environments

• Bioelectronics

• Flexible and additive electronics

• Flexible electronics for medical applications

• Materials for packaging and energy storage

• MEMS

• Photonics

• Power electronics

• Sensors and embedded electronics/ IoT

• Thermal challenges

Conference sponsored by:

· Binghamton University IEEC

· GE Global Research

· IEEE Electronics Packaging Society

 

BECOME A SPONSOR OR EXHIBITOR AND CONNECT WITH INDUSTRY LEADERS

 

SPONSOR $2,500

3 Complimentary

registrations

1 (6) foot table

1 full-page color ad in

program

Company logo & name

on website & signage

 

EXHIBITOR

$1,000

1 Complimentary

registrations

1 (6) foot table

Company name on

website & signage

For more information: epsymposium.com