Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use…read more
Seven Years Of Technical Data: An Overview
November 1st, 2004
The first 1997 issue of ElectronicsCooling started with a Technical Data column, the first of a still continuing series of columns devoted to data that are of interest to thermal designers. In the author’s opinion,…read more
Heat Transfer Enhancement By Using Nanofluids For Cooling Of High Heat Output Microprocessor
November 1st, 2004
It is well known that the thermal properties of heating or cooling fluids play a major role in the development of energy-efficient heat transfer equipment. However, conventional heat transfer fluids such as water, ethylene glycol…read more
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
November 1st, 2004
Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more
Trends in Cooling of Electronics: The Use of Thermal Roadmaps
August 1st, 2004
Introduction Miniaturization, integration of functionality, and the increase of clock speed are recognized business drivers in the electronics industry today. Consequences are the fast increase in power dissipation leading to higher heat fluxes, higher temperatures…read more
Thermal Vias – A Packaging Engineer’s Best Friend
August 1st, 2004
Introduction In the 1990′s, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the…read more
The Thermal Conductivity of Silicon Dioxide
August 1st, 2004
Silicon dioxide (SiO2) is one of the most common and also one of the most important materials in the world as it is the basis for our windows, beaches and wine glasses. It is also…read more
Opto-electronic Transceiver Modules, a System Design Perspective
August 1st, 2004
Introduction Small Form Factor (SFF) optical transceiver packages for use at 1-2 Gbits/s data rates have been described by several authors [1-5]. These rely on dual miniature optical connectors such as the MT-RJ or the…read more
Keep Cool by Sensing Current to Control Fans
August 1st, 2004
Control of cooling fans has become increasingly popular as efforts are made to reduce system power consumption and mechanical fan noise. The purpose of including a fan is to reduce temperature and keep it as…read more
Communication Network Power Efficiency Assessment, Limitations and Directions
August 1st, 2004
Introduction Despite the slowdown in the communication industry, Internet traffic continues to grow rapidly, fueled by the explosion in data communications, mobile Internet, e-commerce, content rich applications, and multi-media services. Internet traffic has increased by…read more
Surface Flatness
May 1st, 2004
Surface flatness is an important issue for thermal designers as it is directly related to thermal contact resistance between surfaces. In this column, the definitions of surface flatness related parameters are discussed. These definitions are…read more
Simple Formulas for Estimating Thermal Spreading Resistance
May 1st, 2004
A problem commonly encountered in the thermal analysis of electronic packages is that of thermal spreading resistance. Thermal spreading resistance occurs as heat flows by conduction between a source and a sink with different cross-sectional…read more
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