FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and thermal specialists alike, FloTHERM IC offers the ease-of-use of Smartpart technology combined with the power of FloTHERM to greatly boost productivity of thermal analysis in the semiconductor industry – immediately and on the user’s desktop. An intuitive wizard-driven user interface, interoperability with package-level EDA tools, and enterprise-level data scalability and portability are other key features of FloTHERM IC.
IC Package Thermal Characterization Made Easy
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- Electronics Cooling December 2013 Issue Now Online
- Thermoelectric Coolers for High Temperature Environments
- Patent for Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader
- New Gap Filler Offers Thermal Conductivity of 1.3W/m-K
- New Thermal Modeling Programs Offer Wide Range of Application Simulations
- Thermal Facts & Fairy Tales: How Useful Are Heat Sink Correlations for Design Purposes?
- Technique Combines Heat Sinks for More Effective Cooling
- New CFD Software Update Offers Efficient Handling of Advanced Designs
Don’t miss out on
the December 2013 issue
of Electronics Cooling, which includes feature articles on Energy-Efficient Warm-Water Cooling of Servers; Thermal Management of Many-core Processors using Power Multiplexing, Characterization of Server Thermal Mass; and more.
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- The Seebeck Coefficient 5 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 13 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 18 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
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