Spire Corp. recently introduced its new high-end tower CPU cooler. Spire codenamed its newest thermal solution Gemini, the Zodiac sign for twins, due to the two towering dimpled fin heat-sinks. The increased number of heat-pipes combined with a higher number and density of dimpled fins and two high airflow fans provide extreme cooling performance. Six U-shaped 6mm heat-pipes are in contact through the solid copper base with the CPU, rapid heat transfer to the 52 aluminum dimpled fins providing a larger surface area for optimum heat dissipation.
Dual Tower Cooler with More Heat Pipes, Dimpled Fans
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- 36th IEEE Compound Semiconductor IC (CSICS) Symposium
- European Microwave Conference
- Therminic 2014, 20th International Workshop on Thermal Investigations of IC’S and Systems
- Xilinx Patent for Critical Tj Prediction
- Two New Grades of Compound to Reduce Cost and Maintain High Performance
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Don’t miss out on
the September 2014 issue
of Electronics Cooling, which includes feature articles on CVD Diamond – Integrating a Superior Thermal Material; An Inexpensive Multi-channel AC Heater Control System; Jet Impingement on Micro Pin Fins; and more!
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- Home 122,349 views
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 26,476 views
- The Seebeck Coefficient 23,888 views
- Advances In High-Performance Cooling For Electronics 19,553 views
- The Thermal Conductivity of Moist Air 16,957 views
- Heat Pipes for Electronics Cooling Applications 16,758 views
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 15,259 views
- Notes on Using Thermocouples 15,237 views