Spire Corp. recently introduced its new high-end tower CPU cooler. Spire codenamed its newest thermal solution Gemini, the Zodiac sign for twins, due to the two towering dimpled fin heat-sinks. The increased number of heat-pipes combined with a higher number and density of dimpled fins and two high airflow fans provide extreme cooling performance. Six U-shaped 6mm heat-pipes are in contact through the solid copper base with the CPU, rapid heat transfer to the 52 aluminum dimpled fins providing a larger surface area for optimum heat dissipation.
Dual Tower Cooler with More Heat Pipes, Dimpled Fans
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- Revisions for CPU Coolers for Intel Xeon
- High Powered Temperature Controller Released
- Ellsworth Adhesives Sales Representatives Awarded 2012 Gold and Bronze Sellers of the Year Awards
- Parker Aerospace to Supply Thermal Management System for Joint Strike Missile
- New Patent-Pending Heat Sink Mounting System
- PCIM Europe Presentation on Solder TIMs for Power Electronics Thermal Management
- Embedded Heat Pipe Technology for Heat Removal in Military Applications
- Effectively Leveraging CAD Data in Electronics Thermal Simulation
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
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- The Seebeck Coefficient 3 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 18 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
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