Spire Corp. recently introduced its new high-end tower CPU cooler. Spire codenamed its newest thermal solution Gemini, the Zodiac sign for twins, due to the two towering dimpled fin heat-sinks. The increased number of heat-pipes combined with a higher number and density of dimpled fins and two high airflow fans provide extreme cooling performance. Six U-shaped 6mm heat-pipes are in contact through the solid copper base with the CPU, rapid heat transfer to the 52 aluminum dimpled fins providing a larger surface area for optimum heat dissipation.
Dual Tower Cooler with More Heat Pipes, Dimpled Fans
Get our newsletter delivered to your email inbox.
- Research Group at U-Michigan Develops Heat-conducting Plastic
- Air Force Funds Thermal Management Project
- Bay Light Heatsinks offer Thermal Solutions
- Lightweight Push-Pin Heat Sinks offer Advanced Cooling Solutions for BGAs
- Low Maintenance Air Conditioner Encompasses New Design
- Low Consumption Fan Offers High Static Pressure
- Inorganic-based Laser Lift-off Transforms Flexible Electronics
- Experiments Demonstrate Graphene is 10 times Stronger than Steel
Don’t miss out on
the December 2014 issue
of Electronics Cooling, which includes feature articles on Carbon-Based Thermal Interface Material; Leakage Power; Thermal Considerations in LED System Modeling; and more!
View Issue »
- Home 122,349 views
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 29,109 views
- The Seebeck Coefficient 25,698 views
- Advances In High-Performance Cooling For Electronics 21,421 views
- The Thermal Conductivity of Moist Air 17,796 views
- Heat Pipes for Electronics Cooling Applications 17,430 views
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 16,579 views
- Notes on Using Thermocouples 16,142 views