Spire Corp. recently introduced its new high-end tower CPU cooler. Spire codenamed its newest thermal solution Gemini, the Zodiac sign for twins, due to the two towering dimpled fin heat-sinks. The increased number of heat-pipes combined with a higher number and density of dimpled fins and two high airflow fans provide extreme cooling performance. Six U-shaped 6mm heat-pipes are in contact through the solid copper base with the CPU, rapid heat transfer to the 52 aluminum dimpled fins providing a larger surface area for optimum heat dissipation.
Dual Tower Cooler with More Heat Pipes, Dimpled Fans
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of Electronics Cooling, which includes articles on Solder Joint Lifetime of Rapidly Cycled LED Components; Advances in Vapor Compression Electronics Cooling; and more.
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- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 5 comment(s)
- Advances In High-Performance Cooling For Electronics 13 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Heat Pipes for Electronics Cooling Applications 9 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 20 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
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