March, 2011

New Grade of Thermal CVD Diamond Material

March 23rd, 2011

Element Six has announced the commercial availability of DIAFILM 200, a diamond thermal material that can offer users thermal conductivity in excess of 2000W/mK. This grade of CVD (chemical vapor deposition) diamond thermal material is…read more

Niagara Thermal Products Acquires Thermshield

March 23rd, 2011

Niagara Thermal Products LLC’s acquisition of Thermshield, LLC brings together two companies in the design and supply of custom thermal solutions across a wide range of markets and applications. Niagara Thermal and Thermshield will continue…read more

Using Simulation to Improve Data Center Efficiency

March 22nd, 2011

This paper describes a new CFD-based modeling capability and design methodology that overcomes the limitations of conventional guidelines and traditional CFD-based approaches and is effective at addressing equipment related cooling and efficiency problems in the…read more

Non-Spill Quick Disconnect Couplings Enhance Thermal Management Systems

March 22nd, 2011

Colder Products Company showcased a broad range of non-spill couplings and solutions for makers of electronic cooling equipment at SEMI-THERM 27. These connectors enable leak-free connection and disconnection of critical fluid lines in liquid cooled…read more

Thermal Conductive Materials & EM Noise Absorbents

March 22nd, 2011

Taica’s Alpha Gel’s softness and conformity help minimize heat resistance and stress on critical devices in electronics. K thermal-conductivity material is available, facilitating heat dissipation results. The gel retains the softness and tackiness of its…read more

High Performance Thermal Greases for Liquid Cooling

March 18th, 2011

Timtronics offers the most advanced, highly conductive, screen printable thermal greases for liquid cooling application. High thermal conductivity up to 7.0  w/mºk , low thermal resistance of 0.01°C-In2 /W Low viscosity & excellent wetting properties…read more

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New White Paper Data Center Cooling Challenges at the Device

March 18th, 2011

Hardcore Computer, Inc. has released “Liquid Blade™ – A Revolution in Data Center Design.” Liquid Blade was named “Best Datacenter Innovation” at the 2010 Blade Insights Summit. An independent study revealed that Liquid Blade can…read more

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IEEE Components, Packaging and Manufacturing Technology Society

March 18th, 2011

The CPMT Society, as the principal sponsor of SEMI-THERM, invites professionals to consider joining the organization for networking, learning, and career development. Access SEMI-THERM papers from 1988 to 2010 at ieeexplore.ieee.org, using the Xplore search capabilities. Visit the group…read more

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Low Resistance, Zero Pump-Out Thermal Pad

March 18th, 2011

AOS Thermal Compounds’ Microfaze 3 A-4 is a non-silicone thermal pad that exhibits low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease.  The pad is composed of…read more

30 GHz Leadless Chip Carrier Packaging Platform

March 18th, 2011

Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for…read more

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Cold Plates for Demanding Military Cooling Applications

March 18th, 2011

Thermacore introduces a new line of cold plates that meet the most recent VME64x/VPX standards and supports commercial off-the-shelf packaging formats. With the thermal performance and flexibility these cold plates offer, military embedded system designers…read more

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Laird Technologies Acquires Klüver Aggregatebau GmbH

March 18th, 2011

Laird Technologies, Inc.’s purchase of Klüver Aggregatebau GmbH expands the scope of Laird’s thermal management business into compressor-based temperature control systems for use in medical, telecommunications, and other end-use markets. Learn more from Laird Technologies.

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Breakthrough Thermal Material System to Enable Faster Computing

March 18th, 2011

Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices,…read more

Ceramic Pump Components for Hybrid Cars

March 18th, 2011

Morgan Technical Ceramics is providing ceramic components for three water cooling pumps that will be used in hybrid and electric vehicles to cool the high energy battery, the cabin heater and the power electronics loop…read more

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