Element Six has announced the commercial availability of DIAFILM 200, a diamond thermal material that can offer users thermal conductivity in excess of 2000W/mK. This grade of CVD (chemical vapor deposition) diamond thermal material is targeted for advanced users that work with high power, or high power density devices, and require extreme performance for their thermal packaging needs. The new product is a DIAFILM TM 200 material, exhibiting a thermal conductivity of Tc>2000 W/mK.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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