A team of University of Illinois engineers has developed a self-healing system that restores electrical conductivity to a cracked circuit in less time than it takes to blink. Led by aerospace engineering professor Scott White and materials science and engineering professor Nancy…read more
IBM Retiree Wins Award from Engineers Society
December 22nd, 2011
Robert E. Simons was named the 2011 winner of the Allan D. Kraus Thermal Management Medal given recently by the committee that manages the annual award for the American Society of Mechanical Engineers. Simons is…read more
New Capacitors with Low Insertion Height
December 22nd, 2011
TDK-EPC has developed a wide range of EPCOS MKP and MKT film capacitors with low insertion heights. The new capacitors with a lead spacing of 37.5 mm feature insertion heights of only 15 or 19 mm. These components…read more
Precision High Voltage Modules
December 22nd, 2011
Spellman High Voltage Electronics Corporation’s new V6 high precision, cost-effective high voltage modules on a common platform include either AC or DC input, with analog or digital interface (RS232) capabilities. The V6 Series offers output…read more
Thermal Modeling and Testing for LEDs and Luminaires
December 22nd, 2011
Mentor Graphics Corp. has introduced the T3Ster (“trister”) thermal transient tester for LEDs, board-level LED arrays and luminaires. Together with the company’s FloTHERM thermal simulation tool based on computational flow dynamics (CFD), lighting designers can…read more
Tiny Solar Cell Saves Money and Energy
December 22nd, 2011
The U.S. Department of Energy’s National Renewable Energy Laboratory recently validated greater than 41 percent efficiency at a concentration of 1,000 suns for tiny cells made by Semprius. The energy conversion efficiency of a solar…read more
Carbon Nanotubes as Conductive Material for Through-Silicon Vias
December 22nd, 2011
A research team at Chalmers is working with carbon nanotubes as conductive material for through-silicon vias. Carbon nanotubes are going to be the most reliable of all conductive materials if it is possible to use…read more
New Method for Enhancing Thermal Conductivity Could Cool Computer Chips
December 22nd, 2011
The surprising discovery of a new way to tune and enhance thermal conductivity gives engineers a new tool for managing thermal effects in smart phones and computers, lasers and a number of other powered devices.…read more
Direct Current-Powered Data Center Module
December 12th, 2011
ABB and IO have agreed to partner in the development of a new data center module based on direct current (DC) power to meet increasing demand for DC data centers. DC-powered technology is being increasingly…read more
Two-Phase Cooling Technology Powered Rack for Wind Turbine Systems
December 12th, 2011
Parker Hannifin Corporation’s new precision cooled rack for cooling critical wind turbine systems features two-phase evaporative cooling technology, which uses non-corrosive, non-conductive fluid, as it vaporizes and cools hot surfaces on contact. Parker’s Precision-Cooled Rack…read more
New Light-Cure Conformal Coating
December 12th, 2011
Ellsworth Adhesives and DYMAX Corporation are launching E-MAX 903-E, a new light-cure conformal coating. E-MAX 903-E will be distributed world-wide exclusively by Ellsworth Adhesives. It has been engineered to cure with UV and visible light…read more
Intelligent Control of Data Center Infrastructures
December 12th, 2011
IO is offering IO OS®, a data center operating system, as a stand-alone software product. Initially introduced in IO’s modular data center technology platform, IO Anywhere®, IO OS now provides IT and data center teams…read more
Inrush Current Limitation in Power Supplies and Motors
December 12th, 2011
TDK-EPC has extended its range of EPCOS inrush current limiters (ICL). The P11 series (B57211P*) covers a resistance range from 4 to 25 Ω (R25). These types are designed for currents from 2.5 to 5 A in the temperature…read more
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