An earlier article in this column considered the problem of cooling electronic components in a closed box [1]. In outdoor applications for example, it may be necessary to totally seal the box to prevent exposure to airborne particulates, water droplets or other sub- stances in the air that could be injurious to the electronic components. In such an application, heat picked up … [Read more...]
Editorial: Looking Back
In the editorial in the fall issue of ElectronicsCooling, my good friend and colleague Clemens Lasance wrote, “It is the privilege of an editor to discuss any subject that comes to mind, as long as it is (remotely) linked to the theme of the journal.” So, as the editor responsible for this issue of the magazine, I want to avail myself of this privilege. As I contemplate what I … [Read more...]
Calculation Corner: A Useful Catalog of Calculation Corner Articles
The first issue of ElectronicsCooling magazine was published in June 1995 with Kaveh Azar as Editor-in-Chief. In 1997 Bruce Guenin joined ElectronicsCooling as an Associate Editor. In the September issue, he published the first Calculation Corner article, which provided a simple description of “One-Dimensional Heat Flow” and occupied one-half page. I was invited to join … [Read more...]
Calculation Corner: Measuring Heat Load to Water in a Rear Door Heat Exchanger Application
For almost 10 years now, the increasing heat loads in data centers have been recognized as a growing problem [1]. One of the approaches that has been effective in attacking this problem is the introduction of a water-cooled heat exchanger at the rear of a rack [2-5]. Using this approach, a part or nearly all the heat load absorbed by air passing over the heat dissipating … [Read more...]
Calculation Corner: Using Vendor Data to Estimate Thermoelectric Module Cooling Performance in An Application Environment
The application of thermoelectric devices to cool electronic components has been of interest to thermal engineers for many years. Thermoelectric (TE) cooling modules offer the potential to either reduce component operating temperatures at a given heat load, or allow higher component heat dissipation at a given temperature level. Readers who are unfamiliar with TE cooling … [Read more...]
