The first issue of *ElectronicsCooling* magazine was published in June 1995 with Kaveh Azar as Editor-in-Chief. In 1997 Bruce Guenin joined *ElectronicsCooling* as an Associate Editor. In the September issue, he published the first Calculation Corner article, which provided a simple description of “One-Dimensional Heat Flow” and occupied one-half page. I was invited to join *ElectronicsCooling* as an Associate Technical Editor in January 2001. In August of that year I began to share responsibility for the Calculation Corner articles with Bruce. Together we have authored a total of 47 Calculation Corner articles.

All of these Calculation Corner articles are still available on the *ElectronicsCooling* website (www.electronics-cooling.com) by entering the appropriate keyword(s). As an aid to the reader, following is a listing of all the Calculation Corner articles, organized chronologically in topic areas. These topic areas include:

1) Heat Transfer Fundamentals;

2) Thermal Spreading Formulas;

3) Heat Sink Analysis and Performance;

4) Package Component Analysis and Performance; and

5) System Cooling Analysis, Applications and Trade-Offs.

Each listing provides the article title, author and date of publication. Beneath each listing is the Internet address of the webpage on which the article may be found. As a further aid to the reader, in the electronic version of this article on the *ElectronicsCooling* website, the Internet address beneath each article is a link, which if clicked on, will take the reader directly to the article.

**Heat Transfer Fundamentals**

**“One-Dimensional Heat Flow”, ***Bruce Guenin, September 1997.*

www.electronics-cooling.com/1997/09/one-dimensional-heat-flow/

**“Convection and Radiation”,** *Bruce Guenin, January 1998.*

www.electronics-cooling.com/1998/01/convection-and-radiation/

**“Convection and Radiation Loss From a Fin”,** *Bruce Guenin, January 1999.*

www.electronics-cooling.com/1999/01/convection-and-radiation-loss-from-a-fin/

**“Don’t Underestimate Radiation in Electronics Cooling”,** *Bruce Guenin, February 2001.*

www.electronics-cooling.com/2001/02/dont-underestimate-radiation-in-electronic-cooling/

**“Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate”,** *Robert Simons, August 2001.*

www.electronics-cooling.com/2001/08/simplified-formula-for-estimating-natural-convection-heat-transfer-coefficient-on-a-flat-plate/

**“Estimating Natural Convection Heat Transfer for Arrays of Vertical Parallel Flat Plates”,** *Robert Simons, February 2002.*

www.electronics-cooling.com/2002/02/estimating-natural-convection-heat-transfer-for-arrays-of-vertical-parallel-flat-plates/

**“Calculations for Thermal Interface Materials”, ***Bruce Guenin, August 2003.*

www.electronics-cooling.com/2003/08/calculations-for-thermal-interface-materials/

**“The 45 Heat Spreading Angle **—** An Urban Legend?”,** *Bruce Guenin, November 2003.*

www.electronics-cooling.com/2003/11/the-45-heat-spreading-angle-an-urban-legend/

**“A Simple Thermal Resistance Model **—** Isoflux Versus Isothermal”,** *Robert Simons, February 2006.*

www.electronics-cooling.com/2006/02/a-simple-thermal-resistance-model-isoflux-versus-isothermal/

**“Comparing Heat Transfer Rates of Liquid Coolants Using the Mouromtseff Number”,** *Robert Simons, May 2006.*

www.electronics-cooling.com/2006/05/comparing-heat-transfer-rates-of-liquid-coolants-using-the-mouromtseff-number/

**Thermal Spreading Formulas and Calculations**

**“The 45 Heat Spreading Angle **—** An Urban Legend?”,** *Bruce Guenin, November 2003.*

www.electronics-cooling.com/2003/11/the-45-heat-spreading-angle-an-urban-legend/

**“Simple Formulas for Estimating Thermal Spreading Resistance”, ***Robert Simons, May 2004.*

www.electronics-cooling.com/2004/05/simple-formulas-for-estimating-thermal-spreading-resistance/

**“Heat Spreading Calculations Using Thermal Circuit Elements”, ***Bruce Guenin, August 2008.*

www.electronics-cooling.com/2008/08/heat-spreading-calculations-using-thermal-circuit-elements/

**Heat Sink Analysis and Performance**

**“Estimating Parallel Plate-Fin Heat Sink Thermal Resistance”, ***Robert Simons, February 2003.*

www.electronics-cooling.com/2003/02/estimating-parallel-plate-fin-heat-sink-thermal-resistance/

**“Estimating Parallel Plate-Fin Heat Sink Pressure Drop”, ***Robert Simons, May 2003.*

www.electronics-cooling.com/2003/05/estimating-parallel-plate-fin-heat-sink-pressure-drop/

“Estimating the Effect of Flow Bypass on Parallel Plate-Fin Heat Sink Performance”,*Robert Simons, February 2004.*

www.electronics-cooling.com/2004/02/estimating-the-effect-of-flow-bypass-on-parallel-plate-fin-heat-sink-performance/

**“Using an Equivalent Heat Transfer Coefficient to Model Fins on a Fin”,** *Robert Simons, May 2005.*

www.electronics-cooling.com/2005/05/using-an-equivalent-heat-transfer-coefficient-to-model-fins-on-a-fin/

**“Estimating Thermal Resistance for Fin-to-Fin Thermal Couplers”, ***Robert Simons, February 2008.*

www.electronics-cooling.com/2008/02/estimating-thermal-resistance-for-fin-to-fin-thermal-couplers/

**“A Simple Method to Estimate Boiling Heat Sink Performance”,** *Robert Simons, February 2009.*

www.electronics-cooling.com/2009/02/a-simple-method-to-estimate-boiling-heat-sink-performance/

**“Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1”,** *Bruce Guenin, December 2010.*

www.electronics-cooling.com/2010/12/calculation-corner-thermal-interactions-between-high-power-packages-and-heat-sinks-part-1/

**“Thermal Interactions Between High-Power Packages and Heat Sinks, Part 2”,** *Bruce Guenin, March 2011.*

www.electronics-cooling.com/2011/03/calculation-corner-thermal-interactions-between-high-power-packages-and-heat-sinks-part-2/

**Package and Component Analysis and
Performance**

**“Conduction Heat Transfer in a Printed Circuit Board”,** *Bruce Guenin, May 1998.*

www.electronics-cooling.com/1998/05/conduction-heat-transfer-in-a-printed-circuit-board/

**“Convection and Radiation Heat Loss From a Printed Circuit Board”,** *Bruce Guenin, September 1998.*

www.electronics-cooling.com/1998/09/convection-and-radiation-heat-loss-from-a-printed-circuit-board/

**“Determining the Junction Temperature in a Plastic Semiconductor Package, Part I”, ***Bruce Guenin, May 1999.*

www.electronics-cooling.com/1999/05/determining-the-junction-temperature-in-a-plastic-semiconductor-package-part-1/

**“Determining the Junction Temperature in a Plastic Semiconductor Package, Part II”, ***Bruce Guenin, September 1999.*

www.electronics-cooling.com/1999/09/determining-the-junction-temperature-in-a-plastic-semiconductor-package-part-ii/

**“Determining the Junction Temperature in a Plastic Semiconductor Package, Part III: The Use of the Junction-to-Board Thermal Characterization Parameter”, ***Bruce Guenin, May 2000.*

www.electronics-cooling.com/2000/05/determining-the-junction-temperature-in-a-semiconductor-package-part-iii-the-use-of-the-junction-to-board-thermal-characterization-parameter/

**“Determining the Junction Temperature in a Plastic Semiconductor Package, Part IV: Localized Heat Generation on the Die”,** *Bruce Guenin, September 2000.*

www.electronics-cooling.com/2000/09/determining-the-junction-temperature-in-a-semiconductor-package-part-iv-localized-heat-generation-on-the-die/

**“Characterizing a Package on a Populated Printed Circuit Board”,** *Bruce Guenin, May 2001.*

www.electronics-cooling.com/?s=characterizing+a+package+on+a+populated+printed+circuit+board&x=36&y=12

**“Simplified Transient Model for IC Packages”,** *Bruce Guenin, August 2002.*

www.electronics-cooling.com/2002/08/simplified-transient-model-for-ic-packages/

**“Thermal Calculations for Multi-Chip Modules”, ***Bruce Guenin, November 2002.*

www.electronics-cooling.com/2002/11/thermal-calculations-for-multi-chip-modules/

**“Thermal Vias **—** A Packaging Engineer’s Best Friend”,** *Bruce Guenin, August 2004.*

www.electronics-cooling.com/2004/08/thermal-vias-a-packaging-engineers-best-friend/

**“Entrance Effects for Heat Flow Into a Multi-Layer Printed Circuit Board”,** *Bruce Guenin, November 2004.*

www.electronics-cooling.com/2004/11/entrance-effects-for-heat-flow-into-a-multi-layer-printed-circuit-board/

**“A Funny Thing Happened on the Way to the Heat Sink”, ***Bruce Guenin, August 2005.*

www.electronics-cooling.com/2005/08/a-funny-thing-happened-on-the-way-to-the-heatsink/

**“So Many Chips, So Little Time: Device Temperature Prediction in Multi-Chip Packages”,** *Bruce Guenin, August 2006.*

www.electronics-cooling.com/2006/08/so-many-chips-so-little-time-device-temperature-prediction-in-multi-chip-packages/

**“Toward a Thermal Figure of Merit for Multi-Chip Packages,” ***Bruce Guenin, November 2006.*

www.electronics-cooling.com/2006/11/toward-a-thermal-figure-of-merit-for-multi-chip-packages/

**“Thermal Strain in Semiconductor Packages, Part I”,** *Bruce Guenin, August 2007.*

www.electronics-cooling.com/2007/08/thermal-strain-in-semiconductor-packages-part-i/

**“Thermal Strain in Semiconductor Packages, Part II”,** *Bruce Guenin, November 2007.*

www.electronics-cooling.com/2007/11/thermal-strain-in-semiconductor-packages-part-ii/

**“Power Map Calculations Using Image Sources and Superposition”,** *Bruce Guenin, November 2008.*

www.electronics-cooling.com/2008/11/power-map-calculations-using-image-sources-and-superposition/

**“Using a Matrix Inverse Method to Solve a Thermal Resistance Network”,** *Robert Simons, May 2009.*

www.electronics-cooling.com/2009/05/using-a-matrix-inverse-method-to-solve-a-thermal-resistance-network/

**“A Spreadsheet Based Matrix Solution for a Thermal Resistance Network: Part 1”,** Ross Wilcoxon, September 2010.

www.electronics-cooling.com/2010/09/calculation-corner-a-spreadsheet-based-matrix-solution-for-a-thermal-resistance-network-part-1/

**“Using Vendor Data to Estimate Thermoelectric Module Cooling Performance in an Application Environment”,** *Robert Simons, July 2010.*

www.electronics-cooling.com/2010/07/using-vendor-data-to-estimate-thermoelectric-module-cooling-performance-in-an-application-environment/

**System Cooling Analysis, Applications and Trade-Offs**

**“Estimating Temperatures in a Water-to-Air Hybrid Cooling System”,** *Robert Simons, May 2002**.*

www.electronics-cooling.com/2002/05/estimating-temperatures-in-a-water-to-air-hybrid-cooling-system/

**“Estimating Temperatures in an Air-Cooled Closed Box Electronics Enclosure”,** *Robert Simons, February 2005.*

www.electronics-cooling.com/2005/02/estimating-temperatures-in-an-air-cooled-closed-box-electronics-enclosure/

**“Using a Simple Air Recirculation Model to Explore Computer Rack Cooling”,** *Robert Simons, February 2007.*

www.electronics-cooling.com/2007/02/using-a-simple-air-recirculation-model-to-explore-computer-rack-cooling/

**“Estimating the Effect of Intercoolers for Computer Rack Cooling”, ***Robert Simons, May 2007.*

www.electronics-cooling.com/2007/05/estimating-the-effect-of-intercoolers-for-computer-rack-cooling/

**“Estimating Dew Point Temperature for Water Cooling Applications”,** *Robert Simons, May 2008.*

www.electronics-cooling.com/2008/05/estimating-dew-point-temperature-for-water-cooling-applications/

**“Measuring Heat Load to Water in a Rear Door Heat Exchanger Application,”** *Robert Simons, June 2011.*

www.electronics-cooling.com/2011/06/calculation-corner-measuring-heat-load-to-water-in-a-rear-door-heat-exchanger-application/

It is hoped that you will find these listings helpful in finding earlier Calculation Corner articles which may be of interest to you. If you have any ideas for specific topics you would like to see covered in future articles, please send Bruce (bruce.guenin@oracle.com) or myself (resimons@att.net) a note. Also, you may note that the September 2010 Calculation Corner article was written by a guest author, Ross Wilcoxon. If you, too, have an idea for an article you would like to submit as a guest author, for possible publication in the Calculation Corner, please contact us.

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