TECA Corp. has introduced two thermoelectric air conditioner models with a heat exchanger mode. They are designed to cool high-heat electronics such as military embedded systems. The heat exchanger mode switches on as the enclosure…read more
Simplified Data Center Rack Cooling Management
June 25th, 2012
The C degree Flow™ strip from Telect simplifies the managing of data center rack temperatures and increases cooling efficiencies. Using the strip’s inherent and bold color-shifting properties, a technician can easily assess data center temperatures…read more
Microblower Based on Piezoelectric Technology
June 25th, 2012
Murata Americas announced the launch of a microblower that uses a piezoelectric diaphragm, which vibrates up and down when a sine wave voltage is applied. The vibrations force air into the microblower and out…read more
Improved Thermal Management in Power Semiconductors with LL Packages
June 25th, 2012
StratEdge Corporation, high-performance semiconductor package maker for microwave, millimeter-wave, and high-speed digital devices, launched the LL family of high-power laminate packages. The LL leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high-power compound…read more
Liquid Dispensed Thermal Interface Material Filler
June 25th, 2012
The Bergquist Company introduced Gap Filler 1000SR, a two-component, room temperature cure, liquid-dispensable thermal interface material that features slump resistance. As dispensed, the material is designed to remain in place and maintain its shape on…read more
Whitepaper on Thermal Management at the Faceplate
June 25th, 2012
OIF published a new whitepaper on Thermal Management at the Faceplate. Issues associated with air cooling of pluggable modules in a line card are examined. Guidance on the necessary communications between optics plug suppliers, the…read more
Thermal Testing Standards for LEDs
June 25th, 2012
JEDEC Solid State Technology Association has announced the publication of a new series of standards for component level testing of high-brightness/power LEDs. The new JESD51-5x series of standards is aimed at thermal characterization of power…read more
Space Exploration and Higher Education Will Both Benefit From New NASA Partnership
June 25th, 2012
NASA Goddard has entered into a collaboration designed to enhance the science, technology, engineering and math capabilities within two Historically Black College and University institutions over the course of a three-year program. Professors and students…read more
Iron-based HTS show Unexpected Electronic Asymmetry
June 25th, 2012
While investigating iron-based HTS, researchers from Kyoto University and the Japan Synchrotron Radiation Research Institute found that its electronic properties were different in the horizontal and vertical directions and provide the strongest evidence yet of…read more
Hot-Water Cooled Supercomputer
June 25th, 2012
The first commercially available computer system that is cooled with hot water rather than air was unveiled at the Leibniz Supercomputer Centre in Munich. The IBM iDataplex system removes heat 4,000 times more efficiently than…read more
Electronics Cooling June Issue Now Online
June 21st, 2012
Don’t miss out on the June 2012 issue of Electronics Cooling, which includes feature articles on hot spot dissipation, spray cooling , metal foam-PCM heat storage technology, and much more. If you would like to receive…read more
Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performance
June 21st, 2012
Thermal design and material selection continues to be a concern for electronic packages, particularly for flip chip ball grid array packages (FCBGA). Lower cost package options are available today, which are finding applications in high…read more
Spray Cooling Heat Transfer – Test and CFD Analysis
June 21st, 2012
Spray cooling processes yield high heat transfer coefficients due to heat absorption associated with latent heat absorption during liquid-vapor phase transition [1-5]. Spray cooling advantages lie in potentially eliminating TIM1 and TIM 2 thermal resistances,…read more
Designing Heat Sinks When a Target Pressure Drop and Flow Rate is Known
June 21st, 2012
Forced convention air cooled heat sinks and liquid cooled cold plates are quite pervasive in their use in electronics cooling applications. While there can be significant debate on whether to air or liquid cool a…read more
Recent Posts
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
- Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
- Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology
- IBM Awarded Contract in First Phase of DARPA ICECool Program
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- The Seebeck Coefficient 3 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 15 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
