June, 2012

Thermoelectric Air Conditioners with Heat Exchanger Mode

June 25th, 2012

TECA Corp. has introduced two thermoelectric air conditioner models with a heat exchanger mode. They are designed to cool high-heat electronics such as military embedded systems. The heat exchanger mode switches on as the enclosure…read more

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Simplified Data Center Rack Cooling Management

June 25th, 2012

The C degree Flow™ strip from Telect simplifies the managing of data center rack temperatures and increases cooling efficiencies. Using the strip’s inherent and bold color-shifting properties, a technician can easily assess data center temperatures…read more

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Microblower Based on Piezoelectric Technology

June 25th, 2012

  Murata Americas announced the launch of a microblower that uses a piezoelectric diaphragm, which vibrates up and down when a sine wave voltage is applied. The vibrations force air into the microblower and out…read more

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Improved Thermal Management in Power Semiconductors with LL Packages

June 25th, 2012

  StratEdge Corporation, high-performance semiconductor package maker for microwave, millimeter-wave, and high-speed digital devices, launched the LL family of high-power laminate packages. The LL leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high-power compound…read more

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Liquid Dispensed Thermal Interface Material Filler

June 25th, 2012

The Bergquist Company introduced Gap Filler 1000SR, a two-component, room temperature cure, liquid-dispensable thermal interface material that features slump resistance. As dispensed, the material is designed to remain in place and maintain its shape on…read more

Whitepaper on Thermal Management at the Faceplate

June 25th, 2012

OIF published a new whitepaper on Thermal Management at the Faceplate. Issues associated with air cooling of pluggable modules in a line card are examined. Guidance on the necessary communications between optics plug suppliers, the…read more

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Thermal Testing Standards for LEDs

June 25th, 2012

JEDEC Solid State Technology Association has announced the publication of a new series of standards for component level testing of high-brightness/power LEDs. The new JESD51-5x series of standards is aimed at thermal characterization of power…read more

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Space Exploration and Higher Education Will Both Benefit From New NASA Partnership

June 25th, 2012

NASA Goddard has entered into a collaboration designed to enhance the science, technology, engineering and math capabilities within two Historically Black College and University institutions over the course of a three-year program. Professors and students…read more

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Iron-based HTS show Unexpected Electronic Asymmetry

June 25th, 2012

While investigating iron-based HTS, researchers from Kyoto University and the Japan Synchrotron Radiation Research Institute found that its electronic properties were different in the horizontal and vertical directions and provide the strongest evidence yet of…read more

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Hot-Water Cooled Supercomputer

June 25th, 2012

The first commercially available computer system that is cooled with hot water rather than air was unveiled at the Leibniz Supercomputer Centre in Munich. The IBM iDataplex system removes heat 4,000 times more efficiently than…read more

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Electronics Cooling June Issue Now Online

June 21st, 2012

Don’t miss out on the June 2012  issue of Electronics Cooling, which includes  feature articles on hot spot dissipation, spray cooling , metal foam-PCM heat storage technology, and much more. If you would like to receive…read more

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Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performance

June 21st, 2012

Thermal design and material selection continues to be a concern for electronic packages, particularly for flip chip ball grid array packages (FCBGA). Lower cost package options are available today, which are finding applications in high…read more

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Spray Cooling Heat Transfer – Test and CFD Analysis

June 21st, 2012

Spray cooling processes yield high heat transfer coefficients due to heat absorption associated with latent heat absorption during liquid-vapor phase transition [1-5]. Spray cooling advantages lie in potentially eliminating TIM1 and TIM 2 thermal resistances,…read more

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Designing Heat Sinks When a Target Pressure Drop and Flow Rate is Known

June 21st, 2012

Forced convention air cooled heat sinks and liquid cooled cold plates are quite pervasive in their use in electronics cooling applications. While there can be significant debate on whether to air or liquid cool a…read more