Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
The Bergquist Company introduced Gap Filler 1000SR, a two-component, room temperature cure, liquid-dispensable thermal interface material that features slump resistance. As dispensed, the material is designed to remain in place and maintain its shape on the target surface, allowing for flexibility in component orientation during assembly. As cured, the soft elastomer provides a thermal conductivity of 1.0 W/mK that is ideal for filling unique and intricate air voids and gaps.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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