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Whitepaper on Thermal Management at the Faceplate

June 25, 2012 Electronics Cooling Standards

OIF published a new whitepaper on Thermal Management at the Faceplate. Issues associated with air cooling of pluggable modules in a line card are examined. Guidance on the necessary communications between optics plug suppliers, the system architects and system thermal designers is provided.
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About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.